1, product type: single-sided, double-sided and multilayer printed circuit board (PCB), flexible (soft) circuit board, buried blind plate.
2, the largest processing size: single panel, double sided board: 1000mm * 600mm multilayer board: 600mm * 600mm
3, the highest number of layers: 20 layers
4, the thickness of the plate: rigid board 0.4mm -4.0mm flexible board 0.025mm---0.15mm
5, the substrate thickness of copper foil: rigid plate 18 2OZ (1/), (1OZ), 70 (2OZ) flexible plate 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm
6, commonly used substrate: FR-4, CEM-3, CEM-1, 94HB, 94VO, poly four vinyl chloride, polyester, poly ammonium.
7, process capability:
(1) drilling: minimum pore size 0.15MM
(2) hole metallization: minimum aperture 0.15mm, plate thickness / aperture ratio 4:1
(3) the wire width: minimum line width: 0.075mm gold plate, tin plate 0.10mm
(4) the wire spacing: minimum spacing: 0.075mm gold plate, tin plate 0.10mm
(5) gold plated plate: nickel layer thickness: "or =2.5 gold thickness: 0.05-0.1 m or according to customer requirements
(6): HASL tin thickness: > or =2.5-5.
(7) milling plate: the minimum distance from the line to the side: 0.15mm hole to the edge of the minimum distance: 0.2mm minimum shape tolerance: + 0.12mm
(8) socket chamfer: angle: 30 degrees, 45 degrees, 60 degrees depth: 1 -3mm
(9) V cut: angle: 30 degrees, 35 degrees, 45 degrees depth: plate thickness 2/3 minimum size: 80mm * 80mm
(10) turn off test:
Maximum test area: 400mm * 500mm
Maximum test point: 8000
Maximum test voltage: 300V
Maximum insulation resistance; 100M
8, welding resistance: 85---105 C / 280 C ---360 C
9, flexible plate resistance to winding / chemical resistance: in line with international standards for printed circuit IPC